Customized LM561C LED PCB with 660nm Osram LED 1-3oz Copper Thickness and 0.8-1.6mm Board Thickness
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Menyoroti
660nm Osram LED PCB
,1-3oz Copper Thickness LED Circuit Board
,0.8-1.6mm Board Thickness Aluminum LED PCB
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Bahan dasarBasis Aluminium
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Ketebalan tembaga1-3oz
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Ketebalan papan0,8-1,6mm
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Ukuran lubang min0.2mm
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Lebar garis min0.1mm
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Jarak garis min0.1mm
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Finishing permukaanHASL OSP ENIG
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Jumlah lapisan1 lapisan
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Warna topeng solderHitam Hitam Hijau Biru Merah, dll.
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Ketebalan Papan Selesai0,1mm-4,0mm
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Toleransi ketebalan papan± 10%
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Lubang Pelapisan Tembaga18-40 mm
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Kontrol Impedansi± 10%
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Lengkungkan & Putar0,70%
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Lebar Jejak Minimal0,075mm (3mil)
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Tempat asalGuangdong, Cina
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Nama merekHS
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SertifikasiCE UL ROHS ISO9001
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Nomor modelLM561C LED PCB
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Kuantitas min Order2
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Harga$12
Customized LM561C LED PCB with 660nm Osram LED 1-3oz Copper Thickness and 0.8-1.6mm Board Thickness
Customized LM561C LED PCB with 660nm Osram LED PCB
We Can Provide:
- 1-12 layer FR4 PCB, 1 layer Aluminum PCB, 1-4 layer Flexible PCB
- 1-3oz copper thickness
- 0.2mm hole size
- 0.1mm track width/space
- SMT PCBA service
Frequently Asked Questions
Q: Can I have a sample to test?
A: Yes, we can send you samples to test.
Q: What specifications do you need for PCB quotation?
A: We need your PCB Gerber file, board thickness, copper thickness, surface finishing and quantity to quote you.
Q: What is the lead time?
A: Samples need 3-5 days, mass production needs 7-10 days, also according to the order volume.
Q: Do you have MOQ limit?
A: Even 1 piece, we care.
Q: Can you offer the best price for us?
A: Yes, we are specialized PCB manufacturer directly, we can offer lower price than any trading company.
Q: How do you ship the goods and how long does it take to arrive?
A: We usually ship by DHL, UPS, FedEx and TNT. It takes 3-5 days to arrive.
Q: What are the payment terms?
A: You can pay us with Paypal, Western Union and T/T Bank.
Q: Can we visit your factory?
A: Yes, welcome to visit our factory anytime, and we will lead you to visit our factory and our production line.
Manufacturing Capability
| Item | Manufacture Capability |
|---|---|
| Material | FR4, CEM-1, Aluminium, Polyamide |
| Layer No. | 1-12 |
| Finished board thickness | 0.1 mm-4.0mm |
| Board Thickness Tolerance | ±10% |
| Cooper thickness | 0.5 OZ-3OZ (18 um-385 um) |
| Copper Plating Hole | 18-40 um |
| Impedance Control | ±10% |
| Warp&Twist | 0.70% |
| Peelable | 0.012"(0.3mm)-0.02'(0.5mm) |
| Min Trace Width (a) | 0.075mm (3mil) |
| Min Space Width (b) | 0.1mm (4 mil) |
| Min Annular Ring | 0.1mm (4 mil) |
| SMD Pitch (a) | 0.2 mm(8 mil) |
| BGA Pitch (b) | 0.2 mm (8 mil) |
| Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
| Solder mask Clearance (b) | 0.1mm (4 mil) |
| Min SMT Pad spacing (c) | 0.1mm (4 mil) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Min Hole size (CNC) | 0.2 mm (8 mil) |
| Min Punch Hole Size | 0.9 mm (35 mil) |
| Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
| Hole Position Tol | ±0.075mm |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-5u'' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm |
| Beveling | 30°45° |
| Gold Finger angle | 15° 30° 45° 60° |
| Certificate | ROHS, ISO9001:2008, SGS, UL certificate |
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