| Artikel | Kapasitas Produksi |
|---|---|
| Bahan | FR4, CEM-1, Aluminium, Polyamide |
| Lapisan No. | 1-12 |
| Ketebalan papan jadi | 0.1 mm-4.0 mm |
| Toleransi Ketebalan Papan | ± 10% |
| Ketebalan Cooper | 0.5 OZ-3OZ (18 um-385 um) |
| Lubang Lapisan Tembaga | 18-40 um |
| Pengendalian impedansi | ± 10% |
| Warp&Twist | 0.70% |
| Dapat dikupas | 0.012" (< 0.3mm) - 0.02' (< 0.5mm) |
| Lebar Risalah Min | 0.075mm (3mil) |
| Min Lebar Ruang | 0.1mm (4 mil) |
| Min Cincin Bulat | 0.1mm (4 mil) |
| SMD Pitch | 0.2 mm ((8 mil) |
| BGA Pitch | 0.2 mm (8 mil) |
| Min Solder Mask Bendungan | 0.0635 mm (2.5mil) |
| Solder mask Clearance (Klearance dari topeng solder) | 0.1mm (4 mil) |
| Min SMT Pad spacing | 0.1mm (4 mil) |
| Ketebalan topeng solder | 0.0007" ((0.018mm) |
| Min Ukuran Lubang (CNC) | 0.2 mm (8 mil) |
| Ukuran Lubang Punch Min | 0.9 mm (35 mil) |
| Toleransi Ukuran Lubang | PTH:±0,075mm; NPTH: ±0,05mm |
| Toleransi Posisi Lubang | ± 0,075mm |
| Pemasangan | HASL: 2.5um HASL bebas timbal: 2.5um Emas perendaman: Nikel 3-7um Au:1-5u" OSP: 0.2-0.5um |
| Toleransi Rangka Panel | CNC: ±0,125mm, Pengetikan: ±0,15mm |
| Pengeboran | 30°45° |
| Sudut jari emas | 15° 30° 45° 60° |
| Sertifikat | ROHS, ISO9001:2008, Sertifikat SGS, UL |